Three processes for automatic soldering machine operation:
1, wetting: wetting process refers to the gap has melted solder bump and crystallization by capillary force along the surface of the base metal of the fine to the surrounding flow, resulting in the materials to be welded is formed on the surface of the adhesive layer, the solder and base metal atoms close to each other, to the atomic gravity effect distance.
conditions causing wetting: the surface of the welded base metal must
be clean and free from oxides or contaminants.
2. Diffusion: as the wetting proceeds, the interdiffusion between solder and base metal atoms begins to occur. Typically, atoms are in thermal vibrational states in lattice lattices, once the temperature is raised. As the atomic activity intensifies, the molten solder and the atoms in the parent material cross each other into the lattice of each other, and the speed and number of atoms are determined by the temperature and time of the heating.
3, metallurgy combination: because solder and base metal interdiffusion between the 2 metals in the formation of a middle layer - metal compound, to obtain good solder joint, is welded between the base metal and solder must form a metal compound, so that the base material to achieve a combination of state firm metallurgy.